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A Method of Depositing Gallium Nitride on a substrate

TECHNOLOGY OVERVIEW

A method of depositing a coating layer comprising gallium nitride on a substrate comprising the steps of: (a) providing the substance having a plurality of side walls and valleys; (b) forming a first layer of gallium nitride deposited on the substrate, by reacting gaseous trimethylgallium and ammonia at a temperature ranging from 400 to 500 degree celcius, such that the first layer is formed on the side walls and the valleys; and (c) forming a second layer of gallium nitride deposited on top of the first layer, by reacting gaseous trimethylgallium and ammonia at a temperature from 1000 to 1200 degree celcius, to obtain the coating layer comprising the first layer of gallium nitride and the second layer to gallium nitride at a thickness from 3.0 to 4.5 um.

Mega - Trends

Chemicals and Materials

Technology Readiness Level (TRL)

TRL 4

Patent Number

PI 2018002272

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Contact person for this offer:

ChM Dr. Lee Ching Shya, PhD (Dual), RTTP

Technology Transfer Manager

Email: leecs@um.edu.my

Tel: +603-7967-7351/ 013-2250151

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