TECH OFFER

A Method Of In-Situ Targeted Interfacial Alloying Of Lead- Free Solder Joints

TECHNOLOGY OVERVIEW

The present invention discloses an in-situ targeted alloying method to reactively dissolve metallic nanoparticles at the solder-substrate interface to control the morphology and growth of intermetallic compounds (IMC) thickness by dispersing metallic nanoparticles into a carrier in lead-free microelectronic assemblies. An in-situ targeted alloying method comprises placing the carrier dispersed with metallic nanoparticles on the substrate, followed by placing and heating lead-free solder alloys on top of the nanoparticles doped carrier to form desired solder joint at the solder-substrate interface.

Mega - Trends

Electronics and Security, Chemicals and Materials

Technology Readiness Level (TRL)

TRL 4

Patent Number

MY-175657-A

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Contact person for this offer:

ChM Dr. Lee Ching Shya, PhD (Dual), RTTP

Technology Transfer Manager

Email: leecs@um.edu.my

Tel: +603-7967-7351/ 013-2250151

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